Products Suppliers Sign in Register

SZ PUFENG PACKING MATERIAL LIMITED

SHENZHEN PUFENG PACKING MATERIAL CO.,LTD SZ PUFENG PACKING MATERIAL LIMITED

Manufacturer from China
Verified Supplier
7 Years
Home Products Catalog Company Profile Quality Control Contact Us Request a Quota
English
Home / Products / Thermal Conductive Pad / Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad /

show pictures

Product Categories

Die Cut Adhesive Tape

 [100]

Double Sided Adhesive Tape

 [212]

Heat Resistant Adhesive Tape

 [54]

Kapton Polyimide Tape

 [57]

Cellular Urethane Foam

 [69]

EPE Foam Sheet

 [23]

PET Protective Film

 [22]

Thermal Conductive Pad

 [40]

Masking Adhesive Tape

 [39]

Copper Foil Tape

 [39]

PTFE Tape

 [29]

Floor Marking Tape

 [21]

Foam Filter Material

 [28]
Contact Now
SZ PUFENG PACKING MATERIAL LIMITED
Visit Website
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsYuna Qin
View Contact Details
Contact Now

Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
  • Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
  • Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
  • Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
  • Bergquist Gap Pad 3500ULM 3.5W/M-K CPU Thermally Conductive Pad
Products Detailed
Bergquist Gap Pad 3500ULM 3.5W/m-K High quality CPU thermally conductive pad Product description : BERGQUIST Gap Pad 3500ULM, also known as Henkel ...
View Products Detailed →

Home Products Suppliers About Us Contact Us Help Site Map 公司介绍 联系我们

Français Русский язык Español 日本語 Português

China Hot Products: A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | 0~9

Copyright © 2009-2025 Everychina.com. All rights reserved. 京ICP备09074326号-4