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SZ PUFENG PACKING MATERIAL LIMITED

SHENZHEN PUFENG PACKING MATERIAL CO.,LTD SZ PUFENG PACKING MATERIAL LIMITED

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Home / Products / Thermal Conductive Pad / Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 Thermal Conductive Silicon Film /

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SZ PUFENG PACKING MATERIAL LIMITED
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsYuna Qin
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Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 Thermal Conductive Silicon Film
Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 Thermal Conductive Silicon Film
  • Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 Thermal Conductive Silicon Film
  • Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 Thermal Conductive Silicon Film
  • Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 Thermal Conductive Silicon Film
  • Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 Thermal Conductive Silicon Film
Products Detailed
Bergquist 0.9W/m·k SIL PAD TSP K900/SP K-4 thermal conductive silicon film Product overview: Using a special Kaoton film substrate, it is a durable ...
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