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SZ PUFENG PACKING MATERIAL LIMITED

SHENZHEN PUFENG PACKING MATERIAL CO.,LTD SZ PUFENG PACKING MATERIAL LIMITED

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7 Years
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Home / Products / Thermal Conductive Pad / 3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin /

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SZ PUFENG PACKING MATERIAL LIMITED
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City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MsYuna Qin
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3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
  • 3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
  • 3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
  • 3W/m·K 0.3~10mm High Thermal Conductivity Electronic Components Heat Conducting Fin
Products Detailed
3W/m·K high thermal conductivity electronic components heat conduction plate Product features/Applications: High cost performance, high thermal ...
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